| 主权项 |
1. A semiconductor device comprising:
a wiring board defined by first and second edges opposite to each other and by third and fourth edges opposite to each other; a first semiconductor chip mounted on one surface of the wiring board via a bonding member; a second semiconductor chip mounted on an other surface of the first semiconductor chip; and external electrodes formed on an other surface of the wiring board and electrically connected to the first and the second semiconductor chips, the external electrodes comprising a plurality of first external electrodes arranged along the first, second, third and fourth edges so as to define a first rectangular shape and a plurality of second external electrodes arranged along the first, second, third and fourth edges so as to define a second rectangular shape that is smaller than the first rectangular shape, the second external electrodes being arranged inside the first rectangular shape, wherein the bonding member includes four peripheral ends defining a third rectangular shape, each of the four peripheral ends is substantially in parallel to the first, second, third and fourth edges of the wiring board, respectively, and wherein each of the four peripheral ends of the bonding member is protruded from a corresponding edge of the first semiconductor chip, and the four peripheral ends of the bonding member are arranged so that the third rectangular shape is positioned between the first rectangular shape and the second rectangular shape in plane view without overlapping the first and second external electrodes. |
