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经营范围
发明名称
The printed circuit board and the method for manufacturing the same
摘要
Provided is a printed circuit board including: an insulating layer; electronic devices embedded, in the insulating layer; and an adhesive layer for fixing the electronic devices.
申请公布号
KR101438915(B1)
申请公布日期
2014.09.11
申请号
KR20120123386
申请日期
2012.11.02
申请人
发明人
分类号
H05K1/18;H05K3/46
主分类号
H05K1/18
代理机构
代理人
主权项
地址
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