| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding method which is capable of selecting a junction shape according to a purpose from junction shapes of various wires to execute wire bonding by using one wire bonding device having a simple configuration, and to provide a wire bonding device.SOLUTION: A front end part of a wire fed from wire supply means is bonded to a first bonding part by bonding means, and then, relative positions of the first bonding part and the wire supply means are displaced in accordance with preliminarily set displacement information during movement of the wire supply means to a second bonding part while the wire is fed from the wire supply means, whereby a preliminarily set wire deforming force is applied to the wire to deform the wire. Thereafter, a part corresponding to a rear end part of the wire fed from the wire supply means is bonded to the second bonding part by the bonding means, and the first bonding part and the second bonding part are electrically connected by the wire having a prescribed junction shape. |
