| 摘要 |
<p>PROBLEM TO BE SOLVED: To adjust the size of a pattern formed of a hydrophilic polymer and a hydrophobic polymer, in substrate processing using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer.SOLUTION: In a substrate processing method, a resist pattern is formed on a wafer (step S3), and a block copolymer is coated on a substrate on which the resist pattern has been formed (step S4). Then, the substrate on which the block copolymer has been coated is subjected to heat treatment to phase separate the block copolymer into a hydrophilic polymer and a hydrophobic polymer. In the heat treatment for the phase separation of a polymer, the concentration of a solvent of a block copolymer contained in the block copolymer coated on a wafer is adjusted to a predetermined concentration.</p> |
