发明名称 |
Methods and Systems for High Bandwidth Chip-to-Chip Communications Interface |
摘要 |
Systems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit chips with low power utilization. Communication is performed using group signaling over multiple wires using a vector signaling code, where each wire carries a low-swing signal that may take on more than two signal values. |
申请公布号 |
US2014254642(A1) |
申请公布日期 |
2014.09.11 |
申请号 |
US201414199960 |
申请日期 |
2014.03.06 |
申请人 |
Kandou Labs, SA |
发明人 |
Fox John;Holden Brian;Hormati Ali;Hunt Peter;Keay John D.;Shokrollahi Amin;Simpson Richard;Singh Anant;Stewart Andrew Kevin John;Surace Giuseppe;Ulrich Roger |
分类号 |
H04L25/02 |
主分类号 |
H04L25/02 |
代理机构 |
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代理人 |
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主权项 |
1. A transceiver comprising:
an interconnection between at least a first and a second integrated circuit device, the interconnection comprising at least one interconnection wire group, wherein each interconnection wire group is a wire group for communicating signals representing a code word of a vector signaling code; an encoder that converts a received transmit data word to a transmit code word of a vector signaling code; a transmit driver that emits physical signals on wires of the interconnection wire group that correspond to elements of the transmit code word; a receiver circuit that detects physical signals on the interconnection wires as elements of a received code word of a vector signaling code comprising a plurality of signal summers each configured to sum physical signals on two selected wires and a plurality of comparators to compare outputs of the signal summers and to generate a decoded output representing a receive data word. |
地址 |
Lausanne CH |