发明名称 Methods and Systems for High Bandwidth Chip-to-Chip Communications Interface
摘要 Systems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit chips with low power utilization. Communication is performed using group signaling over multiple wires using a vector signaling code, where each wire carries a low-swing signal that may take on more than two signal values.
申请公布号 US2014254642(A1) 申请公布日期 2014.09.11
申请号 US201414199960 申请日期 2014.03.06
申请人 Kandou Labs, SA 发明人 Fox John;Holden Brian;Hormati Ali;Hunt Peter;Keay John D.;Shokrollahi Amin;Simpson Richard;Singh Anant;Stewart Andrew Kevin John;Surace Giuseppe;Ulrich Roger
分类号 H04L25/02 主分类号 H04L25/02
代理机构 代理人
主权项 1. A transceiver comprising: an interconnection between at least a first and a second integrated circuit device, the interconnection comprising at least one interconnection wire group, wherein each interconnection wire group is a wire group for communicating signals representing a code word of a vector signaling code; an encoder that converts a received transmit data word to a transmit code word of a vector signaling code; a transmit driver that emits physical signals on wires of the interconnection wire group that correspond to elements of the transmit code word; a receiver circuit that detects physical signals on the interconnection wires as elements of a received code word of a vector signaling code comprising a plurality of signal summers each configured to sum physical signals on two selected wires and a plurality of comparators to compare outputs of the signal summers and to generate a decoded output representing a receive data word.
地址 Lausanne CH