Power semiconductor module with hermetically sealed switching assembly and corresponding production method

摘要

The module has a circuit arrangement including a substrate (2) e.g. direct copper bonding substrate. Power semiconductor components (3) are connected in a circuit compatible manner, by a connecting unit (4). The connecting unit has an alternate series of two electrically conducting layers (40, 42) and an electrically insulated layer (44). The substrate has a sealing surface (200) surrounding the arrangement in an uninterrupted manner. The surface is connected with an associated sealing surface (400) on a layer of the connecting unit, by a connecting layer (60) e.g. prepreg. An independent claim is also included for a method for manufacturing a power semiconductor module.