发明名称 Systems and methods for heat extraction in a power supply
摘要 Power supply and heat sink modules are suitable for use in sealed outdoor enclosures. Circuit elements in the power supply modules are connected to multiple heat sinks. The heat sinks are combined in heat sink modules. The heat sink modules provide high thermal conductivity while avoiding electromagnetic interference.
申请公布号 US8830680(B2) 申请公布日期 2014.09.09
申请号 US201213552049 申请日期 2012.07.18
申请人 Public Wireless, Inc. 发明人 Lui Albert;Sidlauskas Tom
分类号 H05K7/20 主分类号 H05K7/20
代理机构 Procopio, Cory, Hargreaves & Savitch LLP 代理人 Procopio, Cory, Hargreaves & Savitch LLP
主权项 1. A power supply module suitable for use in outdoor equipment with passive cooling, the power supply module comprising: an enclosure including a heat sink module forming a wall of the enclosure, the heat sink module including an outer heat sink, a first inner heat sink, and a thermal interface material disposed between opposing surfaces of the outer heat sink and the first inner heat sink; and a circuit board including a power supply circuit, wherein a first portion of the power supply circuit is thermally coupled to the first inner heat sink.
地址 San Jose CA US