发明名称 ITO SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an ITO sputtering target capable of forming an ITO transparent conductive film having a content of Sn further increased, and a method for manufacturing the same.SOLUTION: The ITO sputtering target is a sintered body obtained by sintering a mixture containing a Sn oxide of 20-80wt% and the remainder consisting of an In oxide at a temperature of 800-1000°C under a pressure of more than 100 Kgf/cmand 500 Kgf/cmor less in non-oxidative atmosphere and has a structure dispersed and distributed by a Sn-oxide phase and an In oxide phase and a relative density of 90% or more. The In oxide and the Sn oxide are powders having an average particle size of 0.1-0.4μm. The ITO sputtering target is formed on the basis of the obtained sintered body.
申请公布号 JP2014162947(A) 申请公布日期 2014.09.08
申请号 JP20130034390 申请日期 2013.02.25
申请人 MITSUBISHI MATERIALS CORP 发明人 JOHO MASANORI;SAITO ATSUSHI
分类号 C23C14/34;C01G19/00 主分类号 C23C14/34
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