| 摘要 |
PROBLEM TO BE SOLVED: To inhibit resonance between a power source wiring layer and a ground wiring layer while inhibiting increase of the manufacturing costs.SOLUTION: A wiring board 1 includes: an insulation substrate 2; and a power source wiring layer 5 and a ground wiring layer 4 which are provided on a main surface or the interior of the insulation substrate 2. The power source wiring layer 5 or the ground wiring layer 4 includes: a wiring body part 4a and a linear wiring part 4b provided at a peripheral region of the wiring body part 4a. The linear wiring part 4b is electrically connected with the wiring body part. |
