Top Port MEMS Cavity Package and Method of Manufacture Thereof

摘要

A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.

主权项

1. A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device, comprising the steps of:
providing a cover having a lid and sidewalls with a port extending through said lid; bonding a first base component to said sidewalls defining an internal cavity having surfaces formed by said lid, said sidewalls and said first base component, said first base component having an aperture extending therethrough; inserting said MEMS device through said aperture and bonding said MEMS device to said lid with said MEMS device at least partially overlapping said port; and bonding a second base component to said first base component to seal said aperture.