发明名称 HIGH DENSITY, LOW LOSS 3-D THROUGH-GLASS INDUCTOR WITH MAGNETIC CORE
摘要 This disclosure provides systems, methods and apparatus for three-dimensional (3-D) through-glass via inductors. In one aspect, the through-glass via inductor includes a glass substrate with a first cavity, a second cavity, and at least two through-glass vias. The through-glass vias include metal bars that are connected by a metal trace. The metal bars and the metal trace define the inductor, and each cavity is at least partially filled with magnetic material. The magnetic material can include a plurality of particles having an average diameter of less than about 20 nm. The first cavity can be inside the inductor and the second cavity can be outside inductor. In some implementations, the first and the second cavity can be vias that extend only partially through the glass substrate.
申请公布号 US2014247269(A1) 申请公布日期 2014.09.04
申请号 US201313784580 申请日期 2013.03.04
申请人 QUALCOMM MEMS Technologies, Inc. 发明人 Berdy David Francis;Kim Jonghae;Zuo Chengjie;Kim Daeik Daniel;Yun Changhan Hobie;Velez Mario Francisco;Lan Je-Hsiung Jeffrey
分类号 H01F17/00;H01F41/14;G06T1/00 主分类号 H01F17/00
代理机构 代理人
主权项 1. A device comprising: a glass substrate; a first cavity defined in the glass substrate; a second cavity defined in the glass substrate, wherein magnetic material is disposed in both the first and the second cavity; at least two through-glass vias extending through the glass substrate, wherein the at least two through-glass vias include metal bars, and wherein the first cavity is between the through-glass vias and at least one of the through-glass vias is between the first cavity and the second cavity; and a metal trace connecting the metal bars between the at least two through-glass vias.
地址 US