发明名称 LOW TEMPERATURE ATOMIC LAYER DEPOSITION OF FILMS COMPRISING SiCN OR SiCON
摘要 Provided are methods for the deposition of films comprising SiCN and SiCON. Certain methods involve exposing a substrate surface to a first and second precursor, the first precursor having a formula (XyH3-ySi)zCH4-z, (XyH3-ySi)(CH2)(SiXpH2-p)(CH2)(SiXyH3-y), or (XyH3-ySi)(CH2)n(SiXyH3-y), wherein X is a halogen, y has a value of between 1 and 3, and z has a value of between 1 and 3, p has a value of between 0 and 2, and n has a value between 2 and 5, and the second precursor comprising a reducing amine. Certain methods also comprise exposure of the substrate surface to an oxygen source to provide a film comprising SiCON.
申请公布号 WO2014134476(A1) 申请公布日期 2014.09.04
申请号 WO2014US19481 申请日期 2014.02.28
申请人 APPLIED MATERIALS, INC.;THOMPSON, DAVID 发明人 THOMPSON, DAVID
分类号 C23C16/22;C23C16/44 主分类号 C23C16/22
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