| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a copper foil with a carrier used in manufacturing a multilayer laminate plate of one or two or more layers used for a printed wiring board or an ultra-thin coreless substrate which uses a resin as a support and arranges an easily peelable copper foil on one surface or both front and rear surfaces thereof, and can achieve cost reduction by the simplification of a printed board manufacturing step and an increase in yield.SOLUTION: A metal foil with a carrier includes a plate-like carrier formed from a synthetic resin, and a metal foil closely attached on at least one surface of the carrier so as to be mechanically peeled therefrom.</p> |
