| 摘要 |
The present invention reduces the size of an inert gas supply and discharge apparatus used in a pulsed sputtering apparatus. An appropriate quantity of an inert gas is efficiently supplied to locations where the inert gas is needed in the pulsed sputtering apparatus. The pulsed sputtering apparatus is provided with a sputtering source that performs pulsed discharges and generates plasma, a gas injection valve that injects and supplies the inert gas to the sputtering source, and a control means for controlling the sputtering source and the gas injection valve. The control means controls the sputtering source and the gas injection valve in such a manner that the gas injection valve intermittently injects the inert gas, and in such a manner that a portion of a period in which the pulse discharges generated in the sputtering source overlaps with a portion of a period in which the inert gas is injected and supplied by the gas injection valve. |
