| 发明名称 |
THERMAL VIAS IN AN INTEGRATED CIRCUIT PACKAGE WITH AN EMBEDDED DIE |
| 摘要 |
In a multi-module integrated circuit package having a package substrate and package contacts, a die is embedded in the package substrate with thermal vias that couple hotspots on the embedded die to some of the package contacts. |
| 申请公布号 |
KR20140107661(A) |
申请公布日期 |
2014.09.04 |
| 申请号 |
KR20147021364 |
申请日期 |
2011.02.28 |
| 申请人 |
QUALCOMM INCORPORATED |
发明人 |
SWEENEY FIFIN;SHAH MILIND P.;VELEZ MARIO FRANCISCO;GASTELUM DAMION B. |
| 分类号 |
H01L23/367;H01L23/498;H01L25/065 |
主分类号 |
H01L23/367 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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