An LED device and method of manufacture including separately coupling a thin flexible interposer and an LED die to a heat sink structure and then electrically coupling the interposer and the LED die together with a wirebond. A specifically shaped perimeter of an aperture within the interposer negates the need for a cavity or alignment markings within the heat sink structure by limiting the orientation in which the die fits within the aperture. Alternatively, an LED device and method of manufacture include coupling a rigid circuit board to an LED die such that electrical contacts of the die are electrically coupled with electrical input/output terminals of the circuit board. This die/board unit is then able to be coupled to a heat sink structure to form a portion of the device.
申请公布号
WO2014134520(A1)
申请公布日期
2014.09.04
申请号
WO2014US19568
申请日期
2014.02.28
申请人
FLEXTRONICS AP, LLC;TAM, SAMUEL;KURWA, MURAD;PANG TAK, SHING DICK