发明名称 HEAT DISSIPATION STRUCTURE AND OPTICAL TRANSCEIVER
摘要 This invention is provided with: a heat transmission member (21) having heat-receiving surfaces (211a, 211b) shaped as a curve along side surfaces (111, 121) of a cylinder part (12) and a stem (11) and provided so that the stem (11) and the cylinder part (12) can be fitted onto the heat-receiving surfaces (211a, 211b), and heat-dissipating surfaces (212a, 212b) provided with projected and retracted portions (213a, 213b); and a casing (22) carrying a light distributer (1) and the heat transmission member (21) and having heat-receiving surfaces (222a, 222b) provided with projected and retracted portions (223a, 223b) which engage with the projected and retracted portions (213a, 213b).
申请公布号 WO2014132524(A1) 申请公布日期 2014.09.04
申请号 WO2013JP83489 申请日期 2013.12.13
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 GOTO, HIDEKI;HIMURA, NAOTO;TANI, NORIYUKI;HAGA, SEIJI;TAMURA, MASAYOSHI
分类号 H01S5/024;H01S5/022 主分类号 H01S5/024
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