| 摘要 |
A printed circuit board includes a printed circuit board, a semiconductor device mounted on the printed circuit board, a capacitor element mounted on the printed circuit board 2, a ground conductor plane to which a ground terminal of the semiconductor device is connected, and first and second power source conductor planes which are arranged so as not to contact with each other. The second power source conductor plane and the ground conductor plane are arranged so as to oppose to each other to form a planar capacitor. The printed circuit board has a first connecting conductor which connects a power source terminal of the semiconductor device with the second power source conductor plane, and a second connecting conductor which connects the first power source conductor plane with the second power source conductor plane through a first terminal of the capacitor element. Thereby, an electromagnetic radiation noise is reduced. |
| 主权项 |
1. A printed circuit board comprising:
a semiconductor device having a power source terminal and a ground terminal; and a printed wiring board on which the semiconductor device is mounted, wherein the printed wiring board comprises:
a first wiring layer formed, as being a first surface layer of the printed wiring board, on which the semiconductor device is mounted;a second wiring layer having a first ground conductor plane to which a ground terminal is connected;a third wiring layer formed from at least one layer having the first power source conductor plane to which a direct power source voltage is applied, and a second power source conductor plane arranged so as to be arranged with a space from the first power source conductor plane in opposition to the first ground conductor plane, such that the second power source conductor plane and the first ground conductor plane form a planner capacitor;a fourth wiring layer forming on the printed wiring board at a second surface layer which is a back side surface of the first surface layer; anda capacitor element mounted on the fourth wiring layer, wherein a first terminal of the capacitor is electrically connected to the power source terminal and a second terminal of the capacitor is electrically connected to the ground terminal,wherein the power source terminal and the second power source conductor plane are connected through a first connecting conductor,the second power source conductor plane and the first power source conductor plane are connected through a second connecting conductor,the first terminal of the capacitor is electrically connected to the second connecting conductor, and the second terminal of the capacitor electrically connected through a third connecting conductor to the first ground conductor plane,and the ground terminal is electrically connected through a fourth connecting conductor to the first ground conductor plane. |
