发明名称 |
Vertical sensor assembly method |
摘要 |
<p>A method to vertically bond a chip to a substrate is provided. The method includes forming a metal bar having a linear aspect on the substrate, forming a solder paste layer over the metal bar to form a solder bar, forming a plurality of metal pads on the substrate, and forming a solder paste layer over the plurality of metal pads to form a plurality of solder pads on the substrate. Each of the plurality of solder pads is offset from a long edge the solder bar by an offset-spacing. The chip to be vertically bonded to the substrate has a vertical-chip thickness fractionally less than the offset-spacing. The chip to be vertically bonded fits between the plurality of solder pads and the solder bar. The solder bar enables alignment of the chip to be vertically bonded.</p> |
申请公布号 |
EP2275383(B1) |
申请公布日期 |
2014.09.03 |
申请号 |
EP20100168299 |
申请日期 |
2010.07.02 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
WAN, HONG;RIEGER, RYAN W.;BOHLINGER, MICHAEL J. |
分类号 |
B81B3/00 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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