| 摘要 |
A modular system enclosure is constructed from a number of thermally insulated, rigid, reinforced plastic boards 13 mounted vertically and regularly spaced with air gaps 14 inbetween, and provides a contained environment for computer equipment, with airflow control. The enclosure provides adjustable induction of cooled or ambient air at the base and exhaust of heated air at the top. Bare electrical equipment is mounted on the thermally insulated boards 13. The air gaps between boards define vertical channels which act like flues, allowing minimal airflow disruption and therefore efficient thermal convection, enhancing thermal transfer from the electrical components. Efficiency can be enhanced by mechanical means to increase airflow from the external input (at the base) to exhaust fans 8 (at top of enclosure) to meet module size requirements. Extracting air rapidly after thermal transfer from these flues reduces the need for active cooling of environmental temperature. |
