| 摘要 |
Provided is an elastic wave device in which cracks are not readily formed in a piezoelectric substrate in flip-chip bonding using a bump, the contact resistance in a contact portion where wiring patterns are electrically connected to each other is low, and the insertion loss can be improved. According to an elastic wave device (1), first and second multilayer electrically conductive films are provided on a piezoelectric substrate (2), the first multilayer electrically conductive film (33) forms an IDT electrode and a first wiring pattern (16), the second multilayer electrically conductive film (31) forms an electrode pad (9) to which a bump (32) is connected and a second wiring pattern (17), at least one contact portion (B) where the second wiring pattern (17) is overlapped on the first wiring pattern (16) so as to be electrically connected to each other is provided, a top electrically conductive film of the first multilayer electrically conductive film (33) is a Ti Film (33a), and a bottom electrically conductive film of the second multilayer electrically conductive film (31) is an Al-based electrically conductive film (31c) composed of Al or an alloy mainly containing an Al. |
