发明名称 |
Foamed electric wire and transmission cable having same |
摘要 |
The foamed electric wire with a conductor and a foamed insulation layer covering the conductor; the foamed insulation layer is obtained by kneading a base resin composed of a high melting point propylene-based resin having a melting point of 150° C. or higher with a master batch containing a thermally decomposing chemical foaming agent and a low melting point propylene-based resin having a melting point of 135° C. or lower and melting the low melting point propylene-based resin followed by foaming by inducing thermal decomposition of the thermally decomposing chemical foaming agent, and a compounding ratio of the low melting point propylene-based resin in the entire resin component formed of the high melting point propylene-based resin and the low melting point propylene-based resin is less than 20% by mass. |
申请公布号 |
US8822825(B2) |
申请公布日期 |
2014.09.02 |
申请号 |
US201213343189 |
申请日期 |
2012.01.04 |
申请人 |
Fujikura Ltd. |
发明人 |
Watanabe Ryo |
分类号 |
H01B3/44;H01B7/00;C08J9/06;H01B7/02 |
主分类号 |
H01B3/44 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. A foamed electric wire, comprising:
a conductor; and a foamed insulation layer covering the conductor, wherein the foamed insulation layer is obtained by: kneading a base resin formed of a high melting point propylene-based resin having a melting point of 150° C. or higher with a master batch containing a thermally decomposing chemical foaming agent and a low melting point propylene-based resin having a melting point of 125° C. or higher and 135° C. or lower and being a random copolymer, and melting the low melting point propylene-based resin, followed by foaming by inducing thermal decomposition of the thermally decomposing chemical foaming agent; and a compounding ratio of the low melting point propylene-based resin in the entire resin component formed of the high melting point propylene-based resin and the low melting point propylene-based resin is less than 20% by mass. |
地址 |
Tokyo JP |