METHOD OF MANUFACTURING HEAT SINK PLATE HAVING EXCELLENT THERMAL CONDUCTIVITY IN THICKNESS DIRECTION AND HEAT SINK PLATE MANUFACTURED BY THE SAME

摘要

The present invention relates to a method of manufacturing a heat-dissipating plate which has excellent thermal conductivity in the thickness direction and is suitably used as a heat sink for preventing performance deterioration of LED chips, semiconductor components, and high-power electronic equipment. The method of manufacturing the heat-dissipating plate according to the present invention, comprises the steps of: (a) coating plate-shaped graphite powder with metal; (b) enabling the plate-shaped graphite powder to be oriented in the horizontal direction by applying vibration to the metal-coated graphite powder; (c) pressurizing and molding the graphite powder oriented in the horizontal direction; (d) producing a bulk material by sintering the pressurized graphite powder; and (e) producing a plate by cutting the bulk material in the vertical direction with respect to the horizontally oriented direction at a certain thickness.