| 摘要 |
An apparatus and a method for cleaning a rear surface of a wafer are provided to regularly maintain a residual time of plasma generated between a wafer and an electrode by forming a plurality of exhaust holes according to a circumference of a wafer holder. A top electrode(200) is arranged inside a chamber(100). The top electrode sprays a gas on a wafer loaded inside the chamber. The top electrode includes an attaching prevention member, an insulation ring, and a cover ring. The attaching prevention member is formed in a bottom edge of the top electrode. The cover ring is arranged in a bottom part of the insulation ring. At least one or more wafer supporting rods(300) support the wafer. A wafer holder(400) supports an edge of the wafer. A bottom electrode(500) has a gap with a bottom part of the wafer. The bottom electrode sprays a gas on a rear surface of the wafer. |
