INFRARED SENSOR MODULE HAVING SILICON INFRARED WINDOW AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention relates to an infrared sensor module having a silicon infrared window, which can improve the transmittance of infrared rays by making the silicon infrared window thin, and in which an infrared sensor is packaged in vacuum, and to a manufacturing method thereof. The infrared sensor module includes a device wafer (10) with an infrared sensor (14) formed on a silicon substrate (12); a cap wafer (20) including a silicon infrared window (24) doped with boron; a spacer (30) interposed between the device wafer (10) and the cap wafer (20); and a binding material (40) combining the device wafer (10) with the cap wafer (20). According to the present invention, the infrared sensor module having a silicon infrared window can obtain an improved infrared sensing effect by comprising a thin silicon infrared window.