| 发明名称 |
RESIN PACKAGE |
| 摘要 |
A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate. |
| 申请公布号 |
US2014239470(A1) |
申请公布日期 |
2014.08.28 |
| 申请号 |
US201313980336 |
申请日期 |
2013.02.14 |
| 申请人 |
PANASONIC CORPORATION |
发明人 |
Yahata Kazuhiro;Uno Takashi;Ikeda Hikaru |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin package comprising:
a die pad having a main surface on which a chip is mounted; at least one lead terminal electrically connected to the chip; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and sealing resin which covers the chip and the thin plate. |
| 地址 |
Kadoma-shi, Osaka JP |
