An electronic component includes a component enclosure. At least one subcomponent is positioned within the component enclosure. The at least one subcomponent is configured to be thermally coupled to the component enclosure.
申请公布号
US2014238647(A1)
申请公布日期
2014.08.28
申请号
US201414185664
申请日期
2014.02.20
申请人
LTX-Credence Corporation
发明人
PIKOVSKY ANATOLY
分类号
H05K7/20
主分类号
H05K7/20
代理机构
代理人
主权项
1. An electronic component comprising:
a component enclosure; at least one subcomponent positioned within the component enclosure; wherein the at least one subcomponent is configured to be thermally coupled to the component enclosure.
