发明名称 MATERIAL FOR PRINTED WIRING BOARD, METHOD OF PRODUCING MATERIAL FOR PRINTED WIRING BOARD, METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a material for printed wiring board which allows for easy manufacturing of a printed wiring board while reducing the manufacturing cost more than conventional.SOLUTION: A long first metal layer 31 on both sides of a long support layer 2, a long second metal layer 32 peelable from the first metal layer 31, a long first insulation layer 51, and a long third metal layer 33 are formed, in this order, so as to be wound like a roll while being laminated and integrated. Both side edges of the first metal layer 31 and second metal layer 32 are arranged on the inside of both side edges of the support layer 2. Both side edges of the first insulation layer 51 are arranged on the outside of both side edges of first metal layer 31 and second metal layer 32.
申请公布号 JP2014157938(A) 申请公布日期 2014.08.28
申请号 JP20130028171 申请日期 2013.02.15
申请人 PANASONIC CORP 发明人 KANETANI DAISUKE
分类号 H05K3/46;H05K3/00 主分类号 H05K3/46
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