发明名称 INJECTION MOULD DEVICE ALLOWING RAPID HEATING AND COOLING, AND INJECTION METHOD FOR SAME
摘要 <p>The present invention concerns an injection mould device equipped with a core mould and a cavity mould, being an injection mould device allowing rapid heating and cooling wherein: the core mould (200) comprises a heating core (210) which is cut to a predetermined thickness in accordance with the shape of a cavity (201) and in which the cut surface incorporates a venting heater (211), and comprises a core-mould-securing plate (220) which secures the heating core (210) and has a cooling means; the cooling means of the core-mould-securing plate (220) also comprises cooling-water-pathway thermally insulating holes (230) for cooling the venting heater (211) and the core-mould-securing plate (220) on the opposite side to the cavity (201) at a distance from the heating core (210), and also comprises second thermally insulating holes (240) for secondary air cooling at a distance from the cooling-water-pathway thermally insulating holes (230); the cooling-water-pathway thermally insulating holes (230) comprise a first cooling-water-pathway thermally insulating holes (231) formed in line with the venting heaters (211) in the heating core (210) between the venting heaters (211), a second cooling-water-pathway thermally insulating hole (232) formed in a direction orthogonal to the venting heaters (211) in a plane to the rear of the second thermally insulating holes (240), and linking cooling-water-pathway thermally insulating holes (233) passing across the second thermally insulating holes (240) so as to connect the first cooling-water-pathway thermally insulating holes (231) with the second cooling-water-pathway thermally insulating holes (232); and cooling-water hermetically sealing thermally insulating pads (234) are added in sites constituting the edges of the first cooling-water-pathway thermally insulating holes (231), where the heating core (210) and the core-mould-securing plate (220) make contact. The present invention also relates to an injection moulding method for the injection mould device.</p>
申请公布号 WO2014129771(A1) 申请公布日期 2014.08.28
申请号 WO2014KR01177 申请日期 2014.02.13
申请人 LEE, SUNG JAE 发明人 LEE, SUNG JAE
分类号 B29C45/73;B29C33/02;B29C45/17 主分类号 B29C45/73
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