发明名称 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 In a component mounting line which connects component mounting machines (M5, M6, …) having a configuration provided with a first substrate carrier mechanism (16A) and a second substrate carrier mechanism (16B), which have substrate retaining units which convey two types of substrates (4A, 4B), which have been passed from an upstream-side device, to a substrate conveying direction so as to align and retain the same, on the basis of a substrate request signal issued from a component mounting machine (M5) disposed at the front of a component mounting line, the 2 types of substrates (4A, 4B) are mixed and allocated to each of the first substrate carrier mechanism (16A) and the second substrate carrier mechanism (16B). As a result, it is possible to improve production efficiency for the two types of substrates (4A, 4B) of different mounting workloads.
申请公布号 WO2014129196(A1) 申请公布日期 2014.08.28
申请号 WO2014JP00888 申请日期 2014.02.20
申请人 PANASONIC CORPORATION 发明人 HIGASHI, MASAYUKI;MORI, TAISUKE;KOUCHI, RYOUJI;YAMAZAKI, TAKUYA;MAEZONO, HISASHI;ANDO, HIROSHI
分类号 H05K13/00 主分类号 H05K13/00
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