| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering target for forming a protective film capable of forming a protective film that has excellent weatherability and etching nature and can inhibit surface color change and form the cross-section after etching into a favorably tapered shape, and to provide a laminate wiring film having the protective film formed by the sputtering target for forming a protective film.SOLUTION: A sputtering target for forming a protective film to be used in forming a protective film on one surface or both surfaces of a Cu wiring film is composed of 8.0 mass% or more and 11.0 mass% or less of Al, 3.0 mass% or more and 5.0 mass% or less of Fe, 0.5 mass% or more and 2.0 mass% or less of Ni, 0.5 mass% or more and 2.0 mass% or less of Mn, and Cu and inevitable impurities of the balance. A laminate wiring film 10 having the Cu wiring film 11 and the protective film 12 formed on one surface or both surfaces of the Cu wiring film 11 has the protective film formed using the sputtering target for forming a protective film. |
