发明名称 POLISHING HEAD IN CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME
摘要 A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including a pressing portion to adsorb and press a substrate, a first partition on the pressing portion and extending from an edge of the pressing portion along a height direction, a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, and a second horizontal extending portion from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion expanding by pneumatic pressure.
申请公布号 US2014242886(A1) 申请公布日期 2014.08.28
申请号 US201414183714 申请日期 2014.02.19
申请人 SAMSUNG ELECTRONICS., LTD. 发明人 WOO Chang Gyu;SHIN Sung Ho;NAM Joo Yeop;CHO Ki Hong
分类号 B24B37/10;B24B41/047;B24B37/32 主分类号 B24B37/10
代理机构 代理人
主权项 1. A polishing head of a chemical mechanical polishing apparatus, comprising: a housing configured to move up and down; a base assembly connected to a bottom of the housing, the base assembly being configured to support the housing; a membrane on a bottom of the base assembly; and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including: a pressing portion configured to adsorb and press a substrate,a first partition on the pressing portion, the first partition extending from an edge of the pressing portion along a height direction,a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, anda second horizontal extending portion extending from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion configured to expand by pneumatic pressure.
地址 Suwon-si KR