IC PACKAGE WITH STAINLESS STEEL LEADFRAME

摘要

Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds.

主权项

1. An apparatus comprising:
an integrated circuit (IC) die having first and second contacts; a stainless steel leadframe having first and second portions separated by at least one opening having sidewalls defined by the leadframe, the at least one opening electrically insulating the first and second portions from one another; a first material on a first surface of the stainless steel leadframe and configured and arranged to adhere to the leadframe; a second material configured and arranged to adhere the IC die to the first material by adhering to both the IC die and the first material; a third material configured and arranged to encapsulate at least a portion of the IC die, the first and third material being configured and arranged to adhere to one another and secure the IC die relative to the leadframe; a first conductor connected between the first contact and the first portion of the leadframe via a first opening in the first material, the first conductor and the IC die being configured and arranged to pass a signal between the first contact and the first portion of the leadframe; and a second conductor connected between the second contact and the second portion of the leadframe, via a second opening in the first material, the second conductor and the IC die being configured and arranged to pass a signal between the second contact and the second portion of the leadframe.