| 发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
| 摘要 |
The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device. |
| 申请公布号 |
US2014239328(A1) |
申请公布日期 |
2014.08.28 |
| 申请号 |
US201414172408 |
申请日期 |
2014.02.04 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE Sang-hyun;KAM Dong-hyuck;YONG Gam-han;HONG Jin-gi;HWANG Seong-deok |
| 分类号 |
H01L33/62;H01L33/60;H01L33/50 |
主分类号 |
H01L33/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device package comprising:
a package substrate in which a via hole is formed; an electrode layer extending through the via hole and along both surfaces of the package substrate; a light emitting device arranged on the package substrate and connected to the electrode layer; and a fluorescence film including:
a first part that fills at least a part of an internal space of the via hole, anda second part that covers at least a part of the light emitting device. |
| 地址 |
Suwon-si KR |
