发明名称 SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a soldering apparatus which allows easy modification of the flowing direction of to-be-soldered objects. ! SOLUTION: A soldering apparatus 1 is for soldering to-be-soldered objects while carrying the objects in a furnace and comprises operation portions 9 and 10 which are arranged on the front surface side of the apparatus and executes e.g. setting of various operation conditions, and the upper half of the apparatus 1 is vertically rotatable, with the rotation supporting point on the apparatus buck surface side as the center and relative to the lower half, in an openable and closable way. The arrangement of the operation parts 9 and 10 is modifiable from the front surface side to the back surface side, and the rotation supporting point of the upper half of the apparatus 1 is modifiable from the back surface side to the front surface side of the apparatus 1. ! COPYRIGHT: (C)2014,JPO&INPIT
申请公布号 JP2014155961(A) 申请公布日期 2014.08.28
申请号 JP20130264868 申请日期 2013.12.24
申请人 YOKOTA TECHNICA:KK 发明人 YOKOTA HACHIJI
分类号 B23K1/008;B23K101/42;H05K3/34 主分类号 B23K1/008
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