PCB WITH EMBEDDED CHIP AND MANUFACTURING METHOD FOR THE SAME

摘要

In a method for manufacturing an embedded PCB according to one aspect of the present invention, a base substrate which includes a first circuit pattern layer formed on at least one surface is prepared. A cavity which penetrates the base substrate is formed. A device chip is mounted on a chip carrier. The chip carrier is attached to the base substrate to locate the device chip in the cavity. A filling material is provided in the cavity to form a filling layer which fixes the device chip. The device chip is arranged in the base substrate by separating the chip carrier from the device chip. A second circuit pattern layer is stacked on the base substrate having the device chip and the filling layer.