| 摘要 |
The invention provides a piece of semiconductor package inspection equipment which utilizes sensors to illuminate at plural angles so as to detect the sensors inside a semiconductor package. The equipment is connected to the welding disc, the welding ball, and the winding wire of a sensor to detect possible defection. The equipment comprises a light filter component which allows the radiated light rays above the sensor to penetrate and have them filtered. The equipment is also provided with a camera for shooting pictures of filtered light. |
