Low stress vias

摘要

A component can include a substrate having a front surface and a rear surface remote therefrom, an opening extending from the rear surface towards the front surface, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The opening can define an inner surface between the front and rear surfaces. The conductive via can include a first metal layer overlying the inner surface and a second metal region overlying the first metal layer and electrically coupled to the first metal layer. The second metal region can have a CTE greater than a CTE of the first metal layer. The conductive via can have an effective CTE across a diameter of the conductive via that is less than 80% of the CTE of the second metal region.

主权项

1. A component, comprising:
a substrate having a front surface and a rear surface remote therefrom, the substrate having a CTE less than 10 ppm/° C.; an opening extending from the rear surface towards the front surface, the opening defining an inner surface between the front and rear surfaces; and a conductive via extending within the opening, the conductive via including a first metal layer overlying the inner surface and a second metal region overlying the first metal layer and electrically coupled to the first metal layer, the second metal region having a CTE greater than a CTE of the first metal layer, the conductive via having an effective CTE across a diameter of the conductive via that is less than 80% of the CTE of the second metal region, wherein the substrate has a transition surface between the opening and at least one of the front or rear surfaces, wherein a radius of the transition surface is greater than 5% of a radius of the opening.