发明名称 Semiconductor device
摘要 Provided is a semiconductor device having a high switching speed. A semiconductor device is provided with an n-type epitaxial layer having a plurality of trenches arranged at prescribed intervals; an embedded electrode formed on an inner surface of the trench through a silicon oxide film to embed each trench; and a metal layer, which is capacitively coupled with the embedded electrode by being arranged above the embedded electrode through a silicon oxide film. In the semiconductor device, a region between the adjacent trenches operates as a channel (current path). A current flowing in the channel is interrupted by covering the region with a depletion layer formed at the periphery of the trenches, and the current is permitted to flow through the channel by eliminating the depletion layer at the periphery of the trenches.
申请公布号 US8816419(B2) 申请公布日期 2014.08.26
申请号 US200812665584 申请日期 2008.06.17
申请人 Rohm Co., Ltd. 发明人 Takaishi Masaru
分类号 H01L29/94 主分类号 H01L29/94
代理机构 Fish & Richardson P.C. 代理人 Fish & Richardson P.C.
主权项 1. A semiconductor device comprising: a first semiconductor layer of one conductivity type having a plurality of trenches arranged at a predetermined interval from one another, and having a predetermined depth and width; a second semiconductor layer of the one conductivity type having a higher concentration than the first semiconductor layer and arranged between mutually adjacent ones of the trenches at a top face of the first semiconductor layer; a plurality of buried electrodes buried in the plurality of trenches respectively; and a plurality of conductor layers inside the plurality of trenches, each of the conductor layers being arranged above a respective one of the buried electrodes with a first insulation film interposed in between so that each of the conductor layers is capacitively coupled to the respective one of the buried electrodes, and each of the plurality of buried electrodes is on a respective interior surface of one of the trenches with another insulation film interposed in between, a thickness of the first insulation film being larger than a thickness of the other insulation film, wherein the plurality of buried electrodes are gate electrodes, wherein, in the first semiconductor layer, regions, which extend between mutually adjacent ones of the plurality of trenches and which function as current passages, are switched between a conducting state and a cut-off state as a voltage applied to the plurality of conductor layers that are connected together to control the plurality of buried electrodes is controlled, and wherein a width of each of the plurality of conductor layers in a direction of arrangement of the trenches is smaller than a width of the plurality of buried electrodes.
地址 Kyoto JP