Method and system for performing different deposition processes within a single chamber

摘要

A method and system for plasma-assisted thin film vapor deposition on a substrate is described. The system includes a process chamber including a first process space having a first volume, a substrate stage coupled to the process chamber and configured to support a substrate and expose the substrate to the first process space, a plasma generation system coupled to the process chamber and configured to generate plasma in at least a portion of the first process space, and a vacuum pumping system coupled to the process chamber and configured to evacuate at least a portion of the first process space. The system further includes a process volume adjustment mechanism coupled to the process chamber and configured to create a second process space that includes at least a part of the first process space and that has a second volume less than the first volume, the substrate being exposed to the second process space.

主权项

1. A system for plasma-assisted thin film vapor deposition on a substrate, comprising:
a processing chamber including a first process space having a first volume; a substrate stage coupled to said processing chamber and configured to support a substrate and expose said substrate to said first process space; a plasma generation system coupled to said processing chamber and configured to generate plasma in at least a portion of said first process space; a process volume adjustment mechanism coupled to said processing chamber and including a movable enclosure device; said movable enclosure device, upon insertion into the first process space, forming a second process space that includes at least a part of the first process space and that has a second volume less than said first volume, said substrate being exposed to said second process space; said moveable enclosure device having a gas manifold configured both to introduce a first process material to said second process space and to evacuate the second process space; and a vacuum pumping system coupled to said processing chamber and configured to evacuate at least a portion of said first process space, wherein said movable enclosure device is configured to extend into said processing chamber by moving laterally into the first process space and across the substrate stage, to move longitudinally to contact said substrate stage, and to isolate said second process space from at least a portion of said first process space.