Application of a processing pin to a gemstone which is to be cut or polished

摘要

A next processing pin is applied as a follow-on pin to a stone, wherein the stone is held by a preceding pin and fixed to the stone by way of a first adhesive bonding location. The preceding pin is separated from the stone. The follow-on pin is fixed to the stone by way of a second adhesive bonding location spaced from the first adhesive bonding location. The follow-on pin frontally receives a fluid adhesive at a spacing from the stone and the spacing between the adhesive-coated front end and the stone is reduced until the adhesive front end contacts the stone. The adhesive is hardened at the contact location as the second adhesive bonding location and heat is transferred by way of the preceding pin to the first adhesive bonding location A force component is exerted on the preceding pin to release the pin from the stone and to hold the stone with the next pin.

主权项

1. A method of applying a next pin as a follow-on pin to a stone wherein the stone is held by a preceding pin fixed to the stone by way of a first adhesive bonding location, wherein the preceding pin (10) is to be separated from the stone to hold it with the next pin as the follow-on pin (20, 30), the follow-on pin is fixed to the stone by way of a second adhesive bonding location (21, 31) spaced from the first adhesive bonding location; wherein
the stone is held by the preceding pin at least during an application of the follow-on pin; the follow-on pin receives a fluid adhesive at a front end thereof and when still being at a distance from the stone and a space between the fluid adhesive carrying front end and the stone is reduced until the fluid adhesive contacts the stone; the fluid adhesive is hardened at the contact location to build the second adhesive bonding location; heat is transmitted to the first adhesive bonding location through the preceding pin, by introducing the heat into the preceding pin at a distance from the first adhesive bonding location to soften or weaken the first adhesive bonding location; a mechanical force component as a transverse force is applied to the preceding pin to release and separate the preceding pin from the stone and holding the stone with the next pin as the follow-on pin at the second adhesive bonding location; and the stone (3) with next and preceding pins thereon is moved and the preceding pin as free-standing pin (10) is moved against and contacts an edge or a leg, while the stone is being held clamped in a chuck (76) at the next pin as follow-on pin.