| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer flexible substrate capable of improving connection reliability by mitigating a stress caused by a difference in coefficient of thermal expansion.SOLUTION: Connecting terminals 12a of a multilayer flexible substrate 10 are connected to a plurality of external electrodes 21 provided on one principal surface of a rigid substrate 20 and when a connecting portion of the rigid substrate 20 and the multilayer flexible substrate 10 is heated by heat generated from a heat generating component mounted on the rigid substrate 20, deformation of a laminate 11 of the multilayer flexible substrates 10 caused by thermal expansion is mitigated by a slit 13a as an expansion absorbing part. Therefore, a stress generated in the connecting portion of the multilayer flexible substrate 10 and the rigid substrate 20 caused by a different in coefficient of thermal expansion can be mitigated by absorbing the deformation of the laminate 11 of the multilayer flexible substrates 10 through the slit 13a, thereby improving connection reliability of the multilayer flexible substrate 10 and the rigid substrate 20. |
