发明名称 DICING/DIE BONDING INTEGRATED TAPE
摘要 PROBLEM TO BE SOLVED: To provide a producible dicing/die bonding integrated tape having high stickiness in the dicing process, and having low stickiness in the pickup process, especially a dicing/die bonding integrated tape having an adhesive layer capable of expressing low stickiness in the pickup process.SOLUTION: In a dicing/die bonding integrated tape where at least a base material layer, an adhesive layer and an adhesion layer are laminated in this order, the dispersion component value Aispersion when dividing the surface free energies A, A of the adhesive layer before ultraviolet light irradiation into a polarity component and a dispersion component, and the surface free energies B of the adhesive layer after ultraviolet light irradiation satisfy the relation of following general formula (I). Aispersion/((B-A)/A)≤20...(I).
申请公布号 JP2014154704(A) 申请公布日期 2014.08.25
申请号 JP20130023316 申请日期 2013.02.08
申请人 HITACHI CHEMICAL CO LTD 发明人 KAYA MICHIKO;SUZUMURA KOJI;SAKUTA TATSUYA;IWANAGA YUKIHIRO
分类号 H01L21/301;C09J4/02;C09J7/02;C09J11/06;C09J133/14;C09J163/00;H01L21/52 主分类号 H01L21/301
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