发明名称 WOODY BOARD
摘要 PROBLEM TO BE SOLVED: To provide, by targeting a woody board using woody chips or woody fibers, a woody board having a high dimensional stability by inhibiting dimensional variations accompanying humidity absorption and release. ! SOLUTION: The provided woody board molded by adhering woody chips or woody fibers via an adhesive includes soft cell-removed bamboo fibers 12 obtained by removing soft cells from bamboo fibers 11 provided by pulverizing a bamboo 10. ! COPYRIGHT: (C)2014,JPO&INPIT
申请公布号 JP2014151599(A) 申请公布日期 2014.08.25
申请号 JP20130024943 申请日期 2013.02.12
申请人 PANASONIC CORP 发明人 MORITA SEISHI ; ASADA TEPPEI
分类号 B27N3/00;B27N3/04 主分类号 B27N3/00
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