| 摘要 |
The present invention relates to a method for manufacturing a PCB. The present invention provides a method for manufacturing a PCB which includes a step (a) of processing oxide on one surface of a Cu substrate, a step (b) of forming a loop-shaped dam protruding from one surface of the Cu substrate, a step (c) of coating insulator in the outside of the dam on one surface of the Cu substrate, a step (d) of stacking a Cu foil on the upper surface of the insulator including the inside region of the dam, a step (e) of etching the Cu foil corresponding to the inside region of the dam, a step (f) of coating the upper surface of the Cu foil with PSR, and a step (g) of plating a part for conduction. Therefore, manufacturing costs and processes can be minimized. |
