发明名称 |
STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBSTRATES |
摘要 |
Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom. |
申请公布号 |
US2014231126(A1) |
申请公布日期 |
2014.08.21 |
申请号 |
US201414183488 |
申请日期 |
2014.02.18 |
申请人 |
INTEGRAL TECHNOLOGY, INC. ;ORMET CIRCUITS, INC. |
发明人 |
Hunrath Christopher A;Tran Khang Duy;Shearer Catherine A;Holcomb Kenneth C;Friesen G Delbert |
分类号 |
H01L21/48 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic substrate z-axis interconnection structure comprising:
a. a bonding film comprising:
i. a reinforcing matrix of c-stage thermosetting resin surrounded by a b-stage thermosetting resin; andii. optionally, a particulate filler; b. at least one hole traversing the bonding film, wherein the at least one hole is filled with a conductive paste. |
地址 |
Lake Forest CA US |