LED CHIP AND METHOD FOR MANUFACTURING THE SAME

摘要

The invention provides a substrate structure used for manufacturing a light-emitting diode and a method for manufacturing the light-emitting diode. The substrate structure includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of grooving structure formed on the first surface of the substrate. The light-emitting diode is formed on the first surface of the substrate.

主权项

1. A light-emitting diode die, comprising:
a transparent substrate; an N-type semiconductor layer positioned on the transparent substrate; a light-emitting layer positioned on the N-type semiconductor layer; and a P-type semiconductor layer positioned on the light-emitting layer, wherein the N-type semiconductor layer, the transparent layer or both have sidewalls with a plurality of recess structures.