| 摘要 |
<p>The present invention relates to a semiconductor package with the improved structure of the binding affinity of a semiconductor substrate, and a method of bonding the semiconductor substrate. More particularly, the present invention relates to a method of bonding the semiconductor substrate and a semiconductor package with the improved structure of the binding affinity of a semiconductor substrate which maximizes binding affinity or adhesion by the combination of the lateral surface of a lead frame, a lower surface, and an upper surface because a solder groove which is inserted into a solder between the upper part of the lead frame and a mold, is formed. The solder of the solder groove is integrally combined in the soldering of the semiconductor substrate.</p> |
