PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a piezoelectric device including a structure with excellent shock resistance for preventing damage from a corner of a package in which a semiconductor circuit board and a cap are integrally formed, and a method for manufacturing the same.SOLUTION: A piezoelectric device comprises: a semiconductor circuit board 21 on which at least a semiconductor circuit is mounted; an integrally formed cap 23 mounted on the semiconductor circuit board 21 and including a recess 22; and a piezoelectric vibration element 24 arranged in the recess 22 of the cap 23. The piezoelectric device also includes an inclined surface 23c chamfered in a corner 23b of the cap 23. When A is the thickness of a side part 23a of the cap 23 and B is the thickness of the minimum distance from the recess 22 of the cap 23 to the inclined surface 23c, the piezoelectric device has a relation of A≤B. In particular, the angle of the inclined surface 23c is preferably 45 degrees.