| 发明名称 |
Device and Method for Manufacturing a Device |
| 摘要 |
A device includes a semiconductor chip including a frontside, a backside, and a side surface extending from the backside to the frontside. The side surface includes a first region and a second region, wherein a level of the first region is different from a level of the second region. The device further includes an electrically conductive material arranged over the backside of the semiconductor chip and over the first region of the side surface, wherein the second region of the side surface is uncovered by the electrically conductive material. |
| 申请公布号 |
US2014232006(A1) |
申请公布日期 |
2014.08.21 |
| 申请号 |
US201313773421 |
申请日期 |
2013.02.21 |
| 申请人 |
INFINEON TECHNOLOGIES AUSTRIA AG |
发明人 |
Vielemeyer Martin |
| 分类号 |
H01L23/48;H01L21/3065 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device, comprising:
a semiconductor chip comprising a frontside, a backside, and a side surface extending from the backside to the frontside, wherein the side surface comprises a first region and a second region, wherein a level of the first region is different from a level of the second region; and an electrically conductive material arranged over the backside of the semiconductor chip and over the first region of the side surface, wherein the second region of the side surface is uncovered by the electrically conductive material. |
| 地址 |
Villach AT |
